Present and Future of Build-up PWB's-Their Possibility and Limitation. Design Method of Build-up PCB, Noise, Thermal and Impedance Matching Including Simulation.
نویسندگان
چکیده
منابع مشابه
architecture and engineering of nanoscale sculptured thin films and determination of their properties
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 1999
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.2.463